SemiLEDs Corporation

Filed a patent for "method and system for transferring alignment marks between substrate systems" on Thu, May 4, 2023

Filed a patent for "method for fabricating (led) dice using laser lift-off from a substrate to a receiving plate" on Thu, February 22, 2024

Filed a patent for "method for fabricating (led) dice using laser lift-off from a substrate to a receiving plate" on Thu, February 29, 2024

Filed a patent for "method for fabricating (led) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate" on Thu, August 25, 2022

Filed a patent for "method for fabricating (led) dice using laser lift-off from a substrate to a receiving plate" on Thu, November 10, 2022

Filed a patent for "method for fabricating (led) dice using laser lift-off from a substrate to a receiving plate" on Thu, January 19, 2023