Kulicke and Soffa Industries, Inc.

Filed a patent for "ultrasonic welding systems for conductive pins, and related methods" on Thu, October 24, 2024

Filed a patent for "methods of processing a substrate on a bonding system, and related bonding systems" on Thu, October 3, 2024

Filed a patent for "methods of automatic recovery for process errors in operating wire bonding machines" on Thu, July 25, 2024

Filed a patent for "bonding systems for bonding a semiconductor element to a substrate, and related methods" on Thu, August 8, 2024

Filed a patent for "systems for stretching a die source, and related methods" on Thu, July 4, 2024

Filed a patent for "methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods" on Thu, February 9, 2023

Filed a patent for "component placement systems, multi-pipette placement heads, and methods of using the same" on Thu, May 18, 2023

Filed a patent for "component placement systems, multi-pipette placement heads, and methods of using the same" on Thu, May 18, 2023

Filed a patent for "methods of calibrating an ultrasonic characteristic on a wire bonding system" on Thu, May 18, 2023

Filed a patent for "lithographic systems and methods of operating the same" on Thu, March 30, 2023

Filed a patent for "lithographic systems and methods of operating the same" on Thu, March 30, 2023

Filed a patent for "methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine" on Thu, June 1, 2023

Filed a patent for "methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods" on Thu, June 1, 2023

Filed a patent for "methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems" on Thu, August 17, 2023

Filed a patent for "methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece" on Thu, August 17, 2023

Filed a patent for "methods of determining suitability of a wire bonding tool for a wire bonding application, and related methods" on Thu, October 12, 2023

Filed a patent for "methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methods" on Thu, October 12, 2023

Filed a patent for "bonding systems, and methods of providing a reducing gas on a bonding system" on Thu, October 12, 2023

Filed a patent for "methods of determining a height, and a height profile, of a wire loop on a wire bonding machine" on Thu, October 19, 2023

Filed a patent for "methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems" on Thu, October 12, 2023

Filed a patent for "wire bonding tools, and related methods of providing the same" on Thu, November 2, 2023

Filed a patent for "methods of improving wire bonding operations" on Thu, November 2, 2023

Filed a patent for "methods of testing bonded wires on wire bonding machines" on Thu, January 11, 2024

Filed a patent for "bonding systems for bonding a semiconductor element to a substrate, and related methods" on Thu, February 22, 2024

Filed a patent for "setting up ultra-small or ultra-thin discrete components for easy assembly" on Thu, November 23, 2023